EOS P500

EOS P 500

The new powder placement device can perform powder placement and heating at speeds up to 0.6 M/SEC. Combined with two 70W high power lasers, the cost of a single component can be reduced by more than 30% . The new 3-stage filter and the intelligent hot gas and protective gas management system ensure favorable process conditions. The system can process polymer materials at operating temperature up to 300 ° C, and can achieve the best material flexibility. Open software interfaces and user-friendly tools support a variety of applications and material development. The EOSAME feature ensures balanced energy input, thus ensuring excellent component attributes. SmartScaling compensates for shrinkage behavior and ensures accurate dimensional accuracy. Widely used sensor technology coupled with optical and thermal monitoring systems can achieve outstanding process monitoring capabilities to meet the requirements of the aerospace and automotive industries. With the aid of EOSYSTEM, the equipment can be operated intuitively. EOS SPRINT 2 supports software integration of CAD systems, such as NX from Siemens, and connects to ERP systems via eos connect. The EOSP500 therefore supports digital control of the production process. Automated interfaces and optimized fittings can dramatically shorten the production cycle and ensure that the molding process lasts several days without maintenance. MATERIAL SUPPORT: PA 2200, PEKK * Molding Size: 500 x 330 x 400 mm layered thickness: 0.06 mm, 0.10 mm, 0.12 mm, 0.15 mm, 0.18 mm some degree of scanning speed: Up to 2 x 10 M/SEC